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    3. Precision Scribing Machine High Speed Stable Cutting Equipment Special for Semiconductor Wafer Glass

    Precision Scribing Machine High Speed Stable Cutting Equipment Special for Semiconductor Wafer Glass

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    Specifications (1) *
    • product_attribute_6a1944a5d512eba1b286946f
    Availability: 100 in stock
    Products subtotal: $16,689.87
    Est. Landed Cost
    Included in Every Order
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    Factory-Direct Access to 1688
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    Consolidated Shipping
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    Supplier Info Products specifications Description Reviews (0) Category Insights
    Products specifications Description Reviews (0) Category Insights

    Supplier info

    Returning Customers
    0%
    Overall Service
    3.5
    Product Accuracy
    3.6

    Product specifications

    Order number:
    Yrqwd801m
    Processing and customization:
    Yes
    Item number:
    Yrqwd801m
    Brand:
    YINRUI
    Model:
    Yrqwd801m
    Power:
    4
    Weight:
    500
    Minimum processing size:
    150 mm
    Maximum processing size:
    200 mm
    Processing thickness range:
    0.02
    Feeding speed:
    1.8
    Overall dimensions:
    About 1030mm*900mm*1750mm
    Types of glass machinery:
    Glass cutting machine
    Type of production line:
    Tempered glass production line
    Types of glass produced:
    Home appliance glass
    Microcrystalline glass
    Ultra thin glass
    Optical glass
    Specifications:
    Φ210mm/φ150mm
    Whether to provide special supply for cross-border export:
    No
    Straight line marking accuracy:
    ±0.03mm
    Precision of special-shaped marking:
    ±0. 1mm--±0 15 mm
    Glass size vertical accuracy:
    ≤0.05℅

    Description

    Precision dicing machine, high-speed stable cutting equipment, dedicated for semiconductor wafer glass
    Precision Scribing Machine High Speed Stable Cutting Equipment Special for Semiconductor Wafer Glass

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